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LPKF MicroLine 2000 P

LPKF MicroLine 2000 P

Precizna obdelava tiskanih vezij in prekrivnih plasti

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Opis
The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

Process advantages due to LPKF MicroLine 2000 systems

Compared to conventional tools, laser processing offers a compelling series of advantages.
  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.


MicroLine 2000 P - Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps


Integration in MES Solutions

The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.


Fotografije
LPKF MicroLine 2000
Rezanje tiskanih vezij in prekrivnih plasti z LPKF MicroLine 2000 sistemi.
Razenje, vrtanje in rezanje žgane keramike.
Rezanje, vrtanje in graviranje nežgane keramike (green tape).
Visokonatančno strukturiranje kovinskih plasti na keramiki.

Obdelava TCO/ITO plasti brez  poškodb substrata.
Vsak laserski pulz odstrani točno določeno količino materiala. Na ta način je mogoče natančno nadzorovati globino reza.
LPKF MicroLine 2000 S PCB Rigid Flex
UV laser loči fleksibilne dele tiskanega vezja od trdnih.
LPKF MicroLine 2000 S PCB Depaneling (Minimal Cutting Channels)
Minimalni rezalni kanali omogočajo boljši razrez tiskanih vezij.

LPKF MicroLine 2000 S PCB Depaneling (Close Cutting)
UV laser reže blizu robu komponent in prevodnih vezi.
LPKF MicroLine 2000 S PCB Depaneling (1.6 mm)
LPKF sistemi omogočajo ločevanje tiskanih vezij do debeline 1,6 mm - odvisno od laserskega vira.



Video



Tehnični podatki
LPKF MicroLine 2000 P
Laserski razred 1
Max. delovna površina
(X x Y x Z)
350 mm x 350 mm x 11 mm
Max. površina prepoznave
(X x Y)
300 mm x 300 mm
Max. velikost materiala
(X x Y)
300 mm x 350 mm
Format vhodnih podatkov Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Največja hitrost obdelovanja Odvisno od aplikacije
Natančnost ± 25 μm (1 mil)
Premer fokusiranega laserskega žarka 20 μm (0.8 mil)
Valovna dolžina laserskega žarka 355 nm
Dimnezije sistema
(Š x V x G)
875 mm x 1 530 mm x 1 300 mm*
Masa ~ 450 kg
Pogoji delovanja
Napajanje
230 VAC, 50-60 Hz, 3 kVA
Hlajenje
Zračno hlajenje (zaprt hladilni sistem)
Temperatura okolja
22 °C ± 2 °C @ ±25 µm (1 Mil) /
22 °C ± 6 °C @ ±50 µm (2 Mil)
Vlažnost
< 60 % (brez pojavljanja kondenza)
Zahtevani dodatki
Sesalec, zunanji podajalnik, vpetost v proizvodnjo linijo


* Višina vključno signalna luč = 2 020 mm

Sistem MicroLine 2000 P je na voljo v več različicah:
MicroLine 2120 P z 10 wattnim laserskim virom, MicroLine 2820 P s 15 wattnim laserskim virom, MicroLine 2920 P s 18 wattnim laserskim virom in MicroLine 2000 P s 27 wattnim laserskim virom.

Prospekt LPKF MicroLine 2000 P (v angleščini)
Prenesi PDF

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